The chip is fabricated by using semiconductor technics and MEMS technics.
芯片利用半导体工艺和MEMS工艺制作。
Using MEMS technics to process the silicon vibration element, in the process two side lithography and etching has being used many times.
介绍了旋转载体用硅微机械陀螺敏感元件的结构和利用双面多次光刻、腐蚀等微机械工艺加工得到硅振动单元的工艺过程。
This task adopt MEMS technics to make Thermal -film air-mass sensor, mostly work is the study and facture of the sense organ of the chip.
本课题采用MEMS工艺制作热膜式气体质量流量传感器，主要工作放在敏感头芯片部分的研制。
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