This method may be further extended to the analysis of other MEMS devices.
这种方法也可以推广应用到其它MEMS器件的优化问题。
This paper reviews the techniques and applications of diamond MEMS devices.
本文主要综述了金刚石MEMS器件的技术和应用。
The invention can be applicable to various MEMS devices with deformable beams.
本发明可应用于多种带有变形梁的MEMS器件中。
The vacuum packaging result of MEMS devices show good effect of this equipment.
MEMS器件真空封装试验表明，该装备封装效果良好。
MEMS devices with minimum volume and cost were realized by the embedded CMOS process.
通过这种嵌入式CMOS工艺技术，可以实现具备最小体积、最低成本的MEMS器件。
It gives full preparation to extract and analysis dynamic characteristics of MEMS devices.
从而为后续MEMS器件动态特征的提取和分析做充分的准备。
The automatic optimization algorithms of structural parameters of MEMS devices are studied.
研究了MEMS器件结构参数的自动优化算法及其实现技术。
This paper introduces the description of VHDL for MEMS devices and gives an example of a lateral resonator.
本文介绍了MEMS器件VHDL描述的过程，并给出了横向谐振器描述的例子。
Thermal mismatch induced by the die bonding structure greatly affects the reliability and performance of MEMS devices.
芯片粘接工艺引起的器件-封装热失配会对MEMS器件的可靠性和性能产生显著影响。
In this paper, the introduction of the MEMS technology and some useful MEMS devices were widely discussed in the first chapter.
论文首先讨论了MEMS技术及几种常用的MEMS典型器件和本论文要用到的微机械加工技术。
It has been proven that the methods of MEMS devices CAD presented here is feasible through two typical devices design and simulation.
通过对两种典型MEMS器件的计算机辅助设计和模拟，从面到点再到面来研究了MEMS器件的计算机辅助设计和模拟。
In the mean time, such new MEMS devices as pico projectors, pressure and humidity sensors are taking the entire market to a new leap.
同时，我们又积极开发新型MEMS产品的开发，例如微型投影仪，压力传感器，湿度传感器等等，这必将让整个MEMS市场有一个新的飞跃。
The materials that the new and advantage performance MEMS devices constitute require high reliability with the structures and properties.
新型、高性能MEMS器件对所用材料的结构和性能有很高要求。
A fiber Fizeau interferometer for measurement of micro-vibration of MEMS devices is presented, which is simple in configuration and easy to operate.
提出一种结构简单、使用方便的用于微电子机械部件运动状态测量的光纤斐索干涉装置。
To perform the simulation of MEMS devices at the system level, the macromodel of equivalent circuit are utilized to build the library unit of IP models.
为实现MEMS器件系统级的模拟，运用等效电路宏模型的方法建立相应的IP模型库单元。
Different kinds of MEMS devices and systems were born in succession along with the development of MEMS technology quickly. One of them was MEMS gas sensor.
随着MEMS技术的飞速发展，各种MEMS器件和系统相继问世，MEMS气敏传感器是其中之一。
From the research of the RF MEMS devices and module, we can assure that the RF MEMS system has an extremely promising future and will be in application rapidly.
从RFMEMS器件和模块的研究可知，RF - MEMS系统的性能和应用前景是不可估量的，RF - MEMS将会很快走入实际应用中。
Each of these many industrial sectors account for hundreds of millions of MEMS devices sold every year in a marketplace now exceeding $10 billion a year in sales.
在这些多种多样的行业中，每一个行业类都用了数以亿计的MEMS装置，每年在市场上的销量超过100亿美元。
Residual stress and thermal induce resistance of complex substrates are theoretical analyzed, and these parameters can't neglect when the MEMS devices are designed.
理论分析了复合基底的微尺度残余应力及其热敏电阻，表明它们对器件的性能影响不可忽视，需要在设计时候给予考虑。
As one of the most important MEMS devices, RF MEMS switches have been applied in front-end circuits of some microwave systems, antenna and phase shift architectures.
射频MEMS开关是重要的射频MEMS器件，一些RF MEMS开关已经应用于部分微波系统的前端电路、数字电容器组和移相网络。
In general, MEMS devices are mm size in overall and um size in local. Thus, the testing technical is required to have high spatial resolution and large field of view.
一般来说，MEMS器件具有毫米级的整体尺寸和微米级的局部尺寸，因此，测试技术要求尽可能同时具有大视场、空间分辨率高的性能。
A laser ablation process has been developed which enables selected areas of the COF overlay to be efficiently ablated with minimal impact to the packaged MEMS devices.
研究的激光融除工艺能够使所选择的COF叠层区域有效融除，而对封装的MEMS器件影响最小。
In the design and fabrication of MEMS devices, MEMS fabrication process based on Silicon is a main technology, to which is deeply paid attention by researchers and industries.
在MEMS器件的设计与加工过程中，键合技术是体硅工艺的一项关键技术。
The principle of process, characteristic and research status on the several typical microfabrication techniques used to fabricate MEMS devices are given a review in this paper.
文章综述了用于制备MEMS器件的几种典型微细加工技术的工艺原理、特点以及研究现状，并展望了这些微细加工技术的发展前景。
The multi-port-element network method is a new unitive modeling of system-level. The fast design and simulation of MEMS devices can be achieved by 3D multi-port-elements library.
多端口组件网络方法是一种新的系统级统一建模方法，通过该方法形成的多端口三维组建库可以实现MEMS器件的快速设计与仿真。
Based on machine micro-vision dynamic testing system for MEMS, the technique of blur image synthesis is presented to exact and analyze in-plane motion characteristic of MEMS devices.
基于机器微视觉的MEMS动态测试系统，利用模糊图像合成技术对MEMS的平面微运动特性参数进行提取和分析。
Internal stresses in micromachined thin films have a great influence on the properties of MEMS devices. Measurement of stresses in the films is critical for process monitoring and MEMS design.
微机械薄膜应力对MEMS器件有较大的影响，因此应力测量对于工艺监控和MEMS器件设计是必须的。
This design proposal of micro pressure sensor array can effectively meeting the measuring requirement of boundary - layer separation point, and expand engineering applied scope of MEMS devices.
设计的微型压力传感器阵列可有效满足边界层分离点的检测要求，进一步拓展了MEMS器件的工程应用范围。
This system employed optical flow technology and microscopic interferometry combining with stroboscopic illumination to realize the measurement of in-plane and out-of-plane motions of MEMS devices.
系统分别采用光流技术和显微干涉技术，结合频闪照明的方法，对MEMS器件的面内和离面运动特性进行了测量。
Indeed, last year, Knowles Acoustics of Itasca, Illinois, which has been making MEMS microphones since 2003, became the first manufacturer to have shipped a billion of the devices.
事实上，伊利诺伊州伊塔斯加的楼氏声学，这家从2003年起制造MEMS麦克风的公司，在去年成为第一家出货量突破十亿大关的制造商。
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