• This paper reviews the techniques and applications of diamond MEMS devices.

    本文主要综述了金刚石MEMS器件的技术和应用。

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  • The invention can be applicable to various MEMS devices with deformable beams.

    本发明可应用于多种带有变形梁的MEMS器件中。

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  • MEMS devices with minimum volume and cost were realized by the embedded CMOS process.

    通过这种嵌入式CMOS工艺技术,可以实现具备最小体积、最低成本的MEMS器件。

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  • The automatic optimization algorithms of structural parameters of MEMS devices are studied.

    研究了MEMS器件结构参数的自动优化算法及其实现技术。

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  • This paper introduces the description of VHDL for MEMS devices and gives an example of a lateral resonator.

    本文介绍了MEMS器件VHDL描述的过程,并给出了横向谐振器描述的例子。

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  • Thermal mismatch induced by the die bonding structure greatly affects the reliability and performance of MEMS devices.

    芯片粘接工艺引起的器件-封装热失配会对MEMS器件的可靠性和性能产生显著影响。

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  • The materials that the new and advantage performance MEMS devices constitute require high reliability with the structures and properties.

    新型、高性能MEMS器件对所用材料的结构和性能有很高要求。

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  • A fiber Fizeau interferometer for measurement of micro-vibration of MEMS devices is presented, which is simple in configuration and easy to operate.

    提出一种结构简单、使用方便的用于微电子机械部件运动状态测量的光纤斐索干涉装置。

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  • To perform the simulation of MEMS devices at the system level, the macromodel of equivalent circuit are utilized to build the library unit of IP models.

    为实现MEMS器件系统级的模拟,运用等效电路宏模型的方法建立相应的IP模型库单元。

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  • Different kinds of MEMS devices and systems were born in succession along with the development of MEMS technology quickly. One of them was MEMS gas sensor.

    随着MEMS技术的飞速发展,各种MEMS器件和系统相继问世,MEMS气敏传感器是其中之一。

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  • From the research of the RF MEMS devices and module, we can assure that the RF MEMS system has an extremely promising future and will be in application rapidly.

    从RFMEMS器件和模块的研究可知,RF - MEMS系统的性能和应用前景是不可估量的,RF - MEMS将会很快走入实际应用中。

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  • As one of the most important MEMS devices, RF MEMS switches have been applied in front-end circuits of some microwave systems, antenna and phase shift architectures.

    射频MEMS开关是重要的射频MEMS器件,一些RF MEMS开关已经应用于部分微波系统的前端电路、数字电容器组和移相网络。

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  • In general, MEMS devices are mm size in overall and um size in local. Thus, the testing technical is required to have high spatial resolution and large field of view.

    一般来说,MEMS器件具有毫米级的整体尺寸和微米级的局部尺寸,因此,测试技术要求尽可能同时具有大视场、空间分辨率高的性能。

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  • A laser ablation process has been developed which enables selected areas of the COF overlay to be efficiently ablated with minimal impact to the packaged MEMS devices.

    研究的激光融除工艺能够使所选择的COF叠层区域有效融除,而对封装的MEMS器件影响最小。

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  • The principle of process, characteristic and research status on the several typical microfabrication techniques used to fabricate MEMS devices are given a review in this paper.

    文章综述了用于制备MEMS器件的几种典型微细加工技术的工艺原理、特点以及研究现状,并展望了这些微细加工技术的发展前景。

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  • The multi-port-element network method is a new unitive modeling of system-level. The fast design and simulation of MEMS devices can be achieved by 3D multi-port-elements library.

    多端口组件网络方法是一种新的系统级统一建模方法,通过该方法形成的多端口三维组建库可以实现MEMS器件的快速设计与仿真。

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  • Based on machine micro-vision dynamic testing system for MEMS, the technique of blur image synthesis is presented to exact and analyze in-plane motion characteristic of MEMS devices.

    基于机器微视觉的MEMS动态测试系统,利用模糊图像合成技术对MEMS的平面微运动特性参数进行提取和分析。

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  • Internal stresses in micromachined thin films have a great influence on the properties of MEMS devices. Measurement of stresses in the films is critical for process monitoring and MEMS design.

    微机械薄膜应力对MEMS器件有较大的影响,因此应力测量对于工艺监控和MEMS器件设计是必须的。

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  • This design proposal of micro pressure sensor array can effectively meeting the measuring requirement of boundary - layer separation point, and expand engineering applied scope of MEMS devices.

    设计的微型压力传感器阵列可有效满足边界层分离点的检测要求,进一步拓展了MEMS器件的工程应用范围。

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  • This system employed optical flow technology and microscopic interferometry combining with stroboscopic illumination to realize the measurement of in-plane and out-of-plane motions of MEMS devices.

    系统分别采用光流技术和显微干涉技术,结合频闪照明的方法,对MEMS器件的面内和离面运动特性进行了测量。

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  • This system employed optical flow technology and microscopic interferometry combining with stroboscopic illumination to realize the measurement of in-plane and out-of-plane motions of MEMS devices.

    系统分别采用光流技术和显微干涉技术,结合频闪照明的方法,对MEMS器件的面内和离面运动特性进行了测量。

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