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多芯片模块 MCM ; MCM-D ; multi chip model
多芯片组件 MCM ; Multi-Chip Module ; MCM-D ; chip module
多芯片集成电路 multichip array ; multichip circuit ; multichip integrated circuit ; multichip ic
多芯片模组 MCM Multichip Module ; multi-chip module -dielectric
多芯片系统 multichip system
微波多芯片组件 MMCM ; Microwave MCM
多芯片封装 MCP
多芯片封包 MCP ; multi chip package
文章评述多芯片封装技术及目前的基本情况，这一技术在手机存储器的应用现状等。
Multi-chip packaging ( MCP ) technologies and their basi status, state-of-art of applications for mobile phone memory are reviewed in this paper.
NVM和模拟电路被嵌入在单个芯片可以掺入由一个多芯片系统通常执行多种功能上。
NVM and analog circuits are embedded on a single chip that can incorporate multiple functions conventionally executed by a multi-chip system.
同时，列举了当前主要的工艺特征与技术要点，从而说明多芯片封装的技术及其发展前景。
The main and important technological points of MCP are also listed and so that the technological superiority and the developmental prospects of these new package technologies are shown.
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