对多芯片组件的布线方法提出了一种新的方法。
This paper presented a new method for multi chip module routing.
多芯片组件（MCM）是实现电子系统小型化的重要手段之一。
MCM is an important method of miniaturizing electronic systems.
文中将涉及微加工技术以及从直流至射频的多芯片全集成新概念。
The concepts of "micromachining" and Multi-Chip-Module (MCM) integrated from DC to RF components will be explained also.
本发明提供一种多芯片封装。该多芯片封装包括多个存储芯片和控制芯片。
The present invention provides a multichip package, including a plurality of storage chips and control chips.
在制作上，根据性能和结构要求，采用了高密度布线、多芯片组装的薄膜工艺。
For fabrication, a thin film process of high density routing and multi-chip assembly is adopted to meet the performance and structure requirements.
文章评述多芯片封装技术及目前的基本情况，这一技术在手机存储器的应用现状等。
Multi-chip packaging ( MCP ) technologies and their basi status, state-of-art of applications for mobile phone memory are reviewed in this paper.
NVM和模拟电路被嵌入在单个芯片可以掺入由一个多芯片系统通常执行多种功能上。
NVM and analog circuits are embedded on a single chip that can incorporate multiple functions conventionally executed by a multi-chip system.
同时，列举了当前主要的工艺特征与技术要点，从而说明多芯片封装的技术及其发展前景。
The main and important technological points of MCP are also listed and so that the technological superiority and the developmental prospects of these new package technologies are shown.
介绍了微电子镀覆在半导体和IC封装、凸点制作、多芯片组件以及微电子机械系统中的应用。
This article describes the application of microelectronic plating in manufacture of semiconductor, IC packaging, micro-bumps, multichip modules and microelectronics mechanical systems.
图案化金属层位于绝缘层上并填入于导通孔中，以作为本实用新型多芯片封装结构的内连线层。
The pattern metal layer is arranged on the insulation layer and filled into the diversion holes, thereby being an inner linking layer of the multi-chip packaging structure of the utility model.
低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)一种理想的组装技术。
Low Temperature Co-fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multi-chip modules (MMCM).
本文提出了一种用于求解高速VLSI和多芯片组件(MCM)中有耗互连线瞬态响应的稳定递归算法。
A stable recursive algorithm is presented for the transient simulation of interconnect systems in the high-speed VLSI and multichip modules (MCMs).
垂直通孔互连是微波多芯片组件封装工艺和理论分析的基础，开展垂直通孔互连的研究有着现实的意义。
Because vertical via interconnect is the base of theoretical analysis and package technics of MMCM, further study on vertical via interconnect is very vital and instructive to reality.
低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)的一种理想的组装技术。
Low Temperature Co fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multichip modules (MMCM).
在3d -MCM(多芯片组件)封装设计中，大功率和高热流密度导致系统的散热成为关键技术之一。
In 3d-mcm (multi chip module) packaging designs, heat dissipation is one of the key issues that must be solved.
阐述了MEMS的主要封装工艺和技术，包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。
Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.
由于FT232芯片出场有一个自己的唯一的序号，你就可以在一个多芯片模块的环境下找出正确的设备。
Because the FT232 chips come with a unique serial number, you can identify the correct device within a multichip environment.
本实用新型公开一种多芯片封装结构，至少包括一承载器、至少一封装模块、一绝缘层及一图案化金属层。
The utility model discloses a multi-chip packaging structure comprising at least a loader, at least a packaging module, an insulation layer and a pattern metal layer.
三星电子公司，是全球领先的半导体和电信制定了一个4gb的多芯片封装(MCP)针对3g手机市场。
Samsung Electronics, a global leader in semiconductor and telecommunication has developed a 4gb multi-chip package (MCP) targeted at 3g mobile phones market.
此外，它还分别使用双芯片模块(DCM)和多芯片模块(MCM)作为其中端服务器和高端服务器的基本构建块。
Further, it USES Dual Chip Modules (DCMs) and Multi-Chip Modules (MCMs) as the basic building blocks for its mid-range and high-end servers, respectively.
因此我们一直致力于一种多芯片的存储策略来进行瘦分区或超额订购，而那个在我们现有的数据中心上用得好极了。
So we've been working on a multi-tier storage strategy to thin-provision or oversubscribe, and that has already been working extremely well in our existing datacenters.
本文将主要讨论现阶段一般的封装失效分析的技术与设备，并且重点研究失效分析技术在多芯片封装领域的应用。
In this thesis, the application of the failure analysis in MCP package technology will be addressed along with some general fa instrument and methods.
通过对多芯片组件(MCM)的结构、失效模式和机理的分析，提出了适合我国生产实际的mcm失效率预计模型。
The structure, failure model and mechanism of MCM are analyzed and the failure rate prediction model for MCM is presented.
简要介绍为满足日益增长的低功耗、轻重量、小体积系统的应用需求而涌现出的多种裸芯片封装与多芯片叠层封装技术。
This paper introduces a number of bare and multichip module stacking technologies that are emerging to meet the ever increasing demands for low power consumption, low weight and compact systems.
多芯片模块现在采用的有机层压板(MCM - L)、陶瓷(MCM - C)和沉积薄膜(MCM - D)的封装技术。
Currently, MCM is classified as laminated multichip module (MCM-L), ceramic multichip module (MCM-C) and multichip module made by deposited thin film (MCM-D) packaging technologies.
COF是一种高性能、多芯片封装工艺技术，在此封装中把芯片包入模塑塑料基板中，通过在元器件上形成的薄膜结构构成互连。
COF is a high performance, multichip packaging technology in which dies are encased in a molded plastic substrate and interconnects are made via a thin-film structure formed over the components.
本文主要论述了MCM工艺过程及多芯片组装技术中的C4技术。并对M CM种类、MCM关键工艺、M CM凸点的制作方法等做了简单介绍。
This paper described the C4 fabrication of Multi-chip-modules and the MCM process, and also described the key point of MCM technology, the variety of MCM, the bump fabrication methods.
在电脑芯片设计，生物学，网络学等方面有相当多的图表应用。
Graphs have many possible applications in computer chip design, biology, networks, etc.
这些(新增)芯片不仅运行速度快，而且功能多，因此，新功能的整合费用也就相对较低。
Such chips do not just go faster, they also do more, and the cost of integrating new functions is relatively low.
如果一家公司决定购买尽可能多的AMD芯片，它的结果会更糟，因为它将不得不花更多的钱去购买英特尔的芯片。
If a firm decided to buy as many AMD chips as possible, it could end up worse off since it might then have to pay more for the chips purchased from Intel.
应用推荐