低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)一种理想的组装技术。

Low Temperature Co-fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multi-chip modules (MMCM).

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低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)的一种理想的组装技术。

Low Temperature Co fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multichip modules (MMCM).

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垂直通孔互连是微波多芯片组件封装工艺和理论分析的基础，开展垂直通孔互连的研究有着现实的意义。

Because vertical via interconnect is the base of theoretical analysis and package technics of MMCM, further study on vertical via interconnect is very vital and instructive to reality.

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