flip chip bonding 倒装焊接 ; 侧装片接合 ; 倒装焊
flip-chip bonding 倒装芯片安装 ; 倒装晶片安装
chip bonding pad 芯片焊盘
die attach or chip bonding 芯片贴装
semiconductor chip bonding 半导体芯片焊接
ultrasonic flip-chip bonding 超声倒装焊
Direct flip-chip bonding 直接倒装芯片接合
Flip-Chip Bonding Technology 覆晶组装技术
The dynamics of ultrasonic transducer for thermosonic flip chip bonding is investigated.
研究了热超声倒装键合设备的核心执行机构——换能系统的动力学特性。
The embedded active chip also can be realized by backside thinning and flip chip bonding.
通过对芯片进行背面减薄和倒装连接，可以实现有源芯片的埋嵌。
The company also undertake external chip bonding, SMT, plug-in, assembly and other services.
同时公司还对外承接芯片邦定、贴片、插件、组装等业务。
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