设计并制作了一种基于LTCC技术的系统级封装多通道射频前端电路。
A system in package(SIP) RF front-end based on LTCC technology was designed, fabricated and tested.
系统级的凝聚特征将设计知识、几何形状以及联接关系等封装起来，克服了传统特征在功能语义表达上的不完备性。
Encapsulating design knowledge, geometry form and conjunction relationship, the agglomerated feature in system-level is generated to maintain the whole semantic elements of a function.
该软件可用于封装，电路板及系统级CFD模拟，包括自然对流、强制对流和辐射传热。
This software can be used for package -, board - or system-level CFD simulation, including natural and forced convection and radiation heat transfer.
该软件可用于封装，电路板及系统级CFD模拟，包括自然对流、强制对流和辐射传热。
This software can be used for package -, board - or system-level CFD simulation, including natural and forced convection and radiation heat transfer.
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