Chemical Mechanical Polishing 化学机械抛光 ; 化学机械研磨 ; 技术 ; 研磨
chemical-mechanical collector 化学
chemical mechanical working 化学机械加工 ; 电热加工 ; 化学坏加工
Chemical Mechanical Planarization 化学机械抛光 ; 化学机械研磨 ; 又称化学机械平坦化
chemical mechanical poslishing 化学机械磨 ; 化学发光
chemical mechanical polishing CMP 化学机械抛光
Chemical Mechanical Planarization CMP 化学机械平坦化
chemical-mechanical damage 化学力学损伤
Chemical mechanical grinding 化学机械磨削
The use of different barrier slurries for copper chemical mechanical planarization CMP creates a challenge for post-CMP cleaning.
铜化学机械平面化不同阻挡层浆料的应用引起了铜CMP后清洗的问题。
Chemical mechanical planarization (CMP) has gained wide acceptance within the semiconductor industry as the preferred method for controlling wafer topography.
化学机械抛光(CMP)在半导体工业内获得了广泛的赞同,对控制形貌起伏的硅片表面当作首选方法。
At the present time, chemical mechanical planarization (CMP) is the most effective technology for global and local planarization of the wafer in IC manufacturing.
目前,化学机械抛光技术(CMP)被认为是能够实现晶圆表面局部平坦化和全局平坦化的最佳方法。
Why? Bundle of properties: mechanical strength, chemical inertness, ease of fabrication: that's not a unique solution.
为什么,属性的总和:,机械强度,化学惰性,易于制造,那不是独特的解决方法。
This is visualizing the process of the conversion of mechanical energy into chemical and electrical energy very nicely.
这一模拟恰到好处地演示了,机械能到化学能和电能的转换过程。
I mentioned previously that we do not know a lot about how the mechanical stimulation is being converted into chemical and electrical energy.
先前我曾说过,对于机械刺激到化学和电能的转换,我们还知之甚少。
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