... highly excited level 强激劝能级 highly packed chip 高密度芯片 hipox 高压氧化 ...
基于136个网页-相关网页
·2,447,543篇论文数据，部分数据来源于NoteExpress
在制作上，根据性能和结构要求，采用了高密度布线、多芯片组装的薄膜工艺。
For fabrication, a thin film process of high density routing and multi-chip assembly is adopted to meet the performance and structure requirements.
使用无引线陶瓷芯片载体(LCCC)可以达到高密度封装。
High density packaging can he achieved by using leadless ceramic chip carriers (LCCCs).
随着IC的高速化、高集成化、高密度化和高性能化，芯片内互连线之间的串扰已经成为影响芯片性能的重要因素之一。
With the IC's higher speed, higher integration, higher density and higher performance, crosstalk has become one of the most important factors which can influence the IC's performance.
应用推荐