在制作上，根据性能和结构要求，采用了高密度布线、多芯片组装的薄膜工艺。
For fabrication, a thin film process of high density routing and multi-chip assembly is adopted to meet the performance and structure requirements.
使用无引线陶瓷芯片载体(LCCC)可以达到高密度封装。
High density packaging can he achieved by using leadless ceramic chip carriers (LCCCs).
随着IC的高速化、高集成化、高密度化和高性能化，芯片内互连线之间的串扰已经成为影响芯片性能的重要因素之一。
With the IC's higher speed, higher integration, higher density and higher performance, crosstalk has become one of the most important factors which can influence the IC's performance.
因此，它们具有打造下一代高密度、非易失存储芯片和模仿生物神经节的逻辑电路的潜力。
As a result, they could potentially underpin a new generation of high density, non-volatile memory chips and logic circuits that mimic biological synapses.
QFN封装的微波芯片采用一种较新的封装形式，这种封装体积很小，特别适合高密度印刷电路板组装。
Quad Flat No-lead(QFN)package of microwave chip is a relatively new packaging. It offers a small size and especially fits for high density printed circuit assembly.
该卡是以高密度高性能的FPGA芯片为核心，图像采集芯片、图像输出芯片、PCI桥芯片、DDR动态存储器等为辅助的PCI扩展卡。
The card is PCI add card, comprised with the core chip, a high density high capability FPGA, and the image collect chip, image output chip, PCI bridge chip and the DDR RAM.
以计算机芯片为例，传统的散热片与风扇组合式散热器已越来越显现出其弱点与局限性，必须求助于新的解决方案，实现高密度热量的转移。
Take computer chips for example, the traditional heat sink-fan cooler increasingly reveals its weaknesses and limitations, so we must put forward new solutions to deliver this high heat transfer flux.
本发明涉及可实现高密度化的芯片部件的安装构造以及安装方法。
Provided are a chip component mounting structure and a chip component mounting method for increasing density.
结果显示，在优化的制备工艺和应用工艺参数的条件下，使用本文中高密度反应器生物芯片对本文中所用样品的检测，可达到100%的灵敏度和100%的特异性。
The research reveals that we had a sensitivity of 100% and a specificity of 100% in the reactor under a optimized producing condition and applying condition.
得到的研究结果可为建立高密度基因芯片脉冲点样技术提供实验研究基础。
The results in this paper can provide a experimental basis for establishing a high-throughput microarray pulse spotting technology.
本芯片是以Atmel高密度非易失性存储器技术生产的。
The device is manufactured using Atmel's high density non-volatile memory technology.
本芯片是以Atmel高密度非易失性存储器技术生产的。
The device is manufactured using Atmel's high density non-volatile memory technology.
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