综述了接插件连续镀金、钯、锡的电镀工艺，包括设备、镀液和镀层性质。

Summarizes continuous plating processes for electronic connector assemblies including gold, palladium and, tin plating solutions, properties of the films, and continuous plating equipment.

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其次是黑色镀层，探讨了目前较受欢迎的电镀黑色锡镍合金及离子镀碳化钛。

Then, black Sn-Ni alloy plating and ti carbide ion plating, quite well received currently, are discussed.

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镀镍前或锡电镀间的阴极接触不良，放电火花将铜材熔成凹洞。

Before or tin plating nickel plating of bad contacts between the cathode, discharge sparks will melt into hollow copper hole.

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