综述了接插件连续镀金、钯、锡的电镀工艺，包括设备、镀液和镀层性质。
Summarizes continuous plating processes for electronic connector assemblies including gold, palladium and, tin plating solutions, properties of the films, and continuous plating equipment.
其次是黑色镀层，探讨了目前较受欢迎的电镀黑色锡镍合金及离子镀碳化钛。
Then, black Sn-Ni alloy plating and ti carbide ion plating, quite well received currently, are discussed.
镀镍前或锡电镀间的阴极接触不良，放电火花将铜材熔成凹洞。
Before or tin plating nickel plating of bad contacts between the cathode, discharge sparks will melt into hollow copper hole.
研究了超声波对锡铋合金电镀的影响。
The effects of ultrasonic on the tin-bismuth alloy electroplating are studied.
结果表明，该添加剂工艺稳定性好，且镀层可焊性优良、抗变色能力强，可取代高污染的锡铅电镀工艺。
The result proves that the process has advantages of high stabilization, excellent solderability and antitarnishing, which may replace high-pollution tin-lead electroplating technology.
介绍了目前常用于电子元器件电镀纯锡液的主要技术要求。
Main technical requirements of pure tin plating bath common used for electronic component and device electroplating were introduced.
介绍了采用两种产品的电镀铅、锡及铅-锡合金工艺。
Lead, tin and tin-lead alloy electroplating technologies using these two products are introduced.
研究了一种新型可焊性光亮锡锑合金电镀工艺的镀液配方和电镀操作条件；
A new electroplating technology of solderable bright Sn-Sb alloy of bath components and operating conditions were studied.
总结了电镀锡、锡铅合金和锡铋合金的分类、特点及应用情况。
The classification, characteristics, and application results of tin, tin lead and tin bismuth electroplating were summarized.
综述了稀土元素的性质和在电镀铬、锡、锌、锌-镍合金、镍-铁合金以及在复合镀技术中的应用现状和前景。
Properties, application and future trend of rare earth elements in electrodeposition of chromium, tin, zinc, Zn-Ni, Ni-Fe and composite coatings are summarized.
研究了从焦磷酸盐槽液中电镀锡镍合金的一种新工艺，讨论了一些电镀参数对锡镍合金镀层的影响。
A new technology of tin-nickel alloy electroplating from a pyrophosphating bath was studied. The effect of some plating parameters on the tin-nickel alloy coating was discussed.
此法已被成功应用于测定锡-铜-铅合金电镀液及其镀层中的锡、铜和铅。
Cu and Pb ions in the alloy plating bath and composition of its deposits.
在含有铅、锡、铜、镍和一些贵金属的电镀池中，甲磺酸(msa)是一种很好的电解质。
Methane sulphonic acid (MSA) has the right combination of properties for electroplating baths containing lead, tin, copper, nickel and some precious metals.
MLCI端头电极锡-铅合金电镀工艺及维护、镀后的清洗、MLCI的储存影响镀层的耐焊性和可焊性。
Solderability of Sn Pb alloy deposit is determined by electroplating process and its maintenance, post treatment rinsing, storage of MLCI, etc.
电镀铜锡合金是一种合适的代镍镀层，它不使人体过敏，能满足防扩散性能的要求，且成本较低。
Cu Sn plating is a right substitute for nickel coating because it is not allergic to human body, can meet anti diffusion requirement and has a lower cost.
介绍了一种金属钮扣电镀古锡的工艺，其主要工序包括除油、卤化物镀锡、氧化发黑、抛光、罩清漆等。
A process for plating Sn on metal fasteners was introduced, including degreasing, halide Sn plating, oxidative blackening, polishing and varnishing.
在研究碱性锡镍合金的电沉积过程中，讨论了镀液中各成分的含量、电镀工艺条件的改变及添加剂对锡镍合金镀层成分和外观的影响规律。
The effect of bath composition, operating conditions and additives on Sn content of electrodeposits during the process of Sn-Ni alloy electroplating in alkaline baths had been studied.
镀锡板就是在冷轧板的表面电镀一层均匀致密的锡层。
Tinned sheet is cold rolled sheet whose surface is electroplated with a layer of uniform and dense tin.
通过这个电镀共沉积的过程，我们有可能用一种单一的方法将金锡合金固体焊料直接镀在晶片上的低共熔点上或其附近。
Using a co-electroplating process, it was possible to plate the Au–Sn solder directly onto a wafer at or near the eutectic composition from a single solution.
介绍了电镀铜锡合金工艺的研究进展和应用、电镀铜锡合金镀液配方和工艺条件。
The research progresses and applications of Cu-Sn alloy plating process are presented, and the bath formulations and operational conditions of Cu-Sn alloy plating process are also introduced.
锡粒：本公司生产的锡粒大小适中，其合金成份可依据不同要求而定制。对目前的电镀工艺应用较为适合。
Tin Grains:Our tin grains are of moderate size. Special alloy compositions are available upon request. This product is an ideal material applied to the existing electroplating techniques.
的锡焊尾，电镀。
在刚形成的电镀多层结构表面上用光显微镜观察室温下在金属锡上形成的金的扩散薄膜。
Interdiffusion of thin film Au in metallic Sn at room temperature is observed by light microscope on fresh electroplated multilayer surface.
简要介绍了已开发的多层镍电镀工艺、铜锡合金、铜锌合金、锌铁合金、镍铁合金等代镍工艺，以及厚(薄)铜薄镍电镀工艺。
The developed processes such as multi-layer nickel plating, tin-copper alloy plating, zinc-copper alloy plating, iron-zinc alloy plating, iron-nickel plating and thick copper with thin nickel la...
触点电镀：镀镍金的接触面积的锡焊尾电镀。
Contact plating: Gold plating over Nickel on contact area tin plating on solder tail.
作为目前广泛使用的耗时长的固体贴装预制件的代替品，一种用电镀共沉积得到的金锡合金共晶焊料被用于该项研究中。
As an alternative to the time-consuming solder pre-forms and pastes currently used, a co-electroplating method of eutectic au-sn alloy was used in this study.
武钢冷轧厂电镀锡线锡层厚度无模型自适应（FMA）控制系统是专门为了解决大滞后时变的非线性复杂系统控制难题而研制设计的。
Tin thickness closed-loop control for tinning line, a kind of typical non-linear complex system with large time delay, is discussed.
着重介绍了电镀金、金锡、锡铅、锡银和化学镀镍凸点的工艺过程，最后简单介绍了制备凸点的电镀设备。
Electroplating processes of Au, Au-Sn, Sn-Pb, Sn-Ag and chemical nickel-plated bumpings are described in particular. And finally, electroplating equipments for bumping formation are introduced.
着重介绍了电镀金、金锡、锡铅、锡银和化学镀镍凸点的工艺过程，最后简单介绍了制备凸点的电镀设备。
Electroplating processes of Au, Au-Sn, Sn-Pb, Sn-Ag and chemical nickel-plated bumpings are described in particular. And finally, electroplating equipments for bumping formation are introduced.
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