...企业在技术开发方面也有很多困难,而且将来的设备材料技术将需要使用300㎜ 矽基板(silicon substrate)和铜制程(copper wiring)等新的技术设备,国内的设备材料产业在较短时间内要想改善还比较困难。
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Then we will discuss the "wedge-shaped structure" noise of EM test on the upstream structure with top metal of Cu process. Blech length is the critical length of interconnection EM effect.
2,从铜制程的枯层金属1-2-1结构(upstream)的异常电迁移失效现象,探讨了带“楔形“引线端结构在电迁移测试中引起的干扰。
参考来源 - 金属互连线的可靠性研究·2,447,543篇论文数据,部分数据来源于NoteExpress
去胶渣与化学沉铜制程是否使用SPC ?超出管控要求时,是否采取相应的改善措施?
Is SPC used for Desmear and Electroless process? Is the corrective action taken for the out of control status?
半导体制程技术包括氧化、扩散、热处理、合金化、再流动制程、铜制程及化学机械研磨制程简介。
Introduction to semiconductor manufacturing technology including oxidation, diffusion, alloying, re-flow process, copper process and chemical-mechanical polishing.
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