钎料的钎焊性能很大程度取决于钎料对基板上的润湿性能，而润湿性能与液态钎料在基板上的液、固、气三相界面的界面张力有关。
The solderability of electronic solders depends to a great extent on the wettability, which relates to solid, liquid and gas interfacial tensions of the melted solders on substrates.
钎料的钎焊性能很大程度上取决于钎料对基板的润湿性能，而润湿性能与液态钎料在基板上的液、固、气三相界面的界面张力有关。
The solderability depends on a great extent on the wettability, which relates to solid, liquid and gas interfacial tensions of the melted solders on substrates.
与传统的活性金属钎焊不同，它采用的是一种高温下形成液相的氧化物-金属钎料，并且钎焊过程不需要真空或惰性气氛保护。
Different from the traditional active metal brazing, RAB uses a liquid-phase oxide-metal melt at high temperature and the process does not require a vacuum or inert atmosphere.
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