钎料的钎焊性能很大程度取决于钎料对基板上的润湿性能，而润湿性能与液态钎料在基板上的液、固、气三相界面的界面张力有关。
The solderability of electronic solders depends to a great extent on the wettability, which relates to solid, liquid and gas interfacial tensions of the melted solders on substrates.
钎料的钎焊性能很大程度上取决于钎料对基板的润湿性能，而润湿性能与液态钎料在基板上的液、固、气三相界面的界面张力有关。
The solderability depends on a great extent on the wettability, which relates to solid, liquid and gas interfacial tensions of the melted solders on substrates.
与传统的活性金属钎焊不同，它采用的是一种高温下形成液相的氧化物-金属钎料，并且钎焊过程不需要真空或惰性气氛保护。
Different from the traditional active metal brazing, RAB uses a liquid-phase oxide-metal melt at high temperature and the process does not require a vacuum or inert atmosphere.
而在接触反应钎焊的中间层材料选择过程中，考虑接触反应液相产生的方向性是发挥接触反应钎焊优越性的保障。
So, in order to gain good brazed joint in contact reactive brazing, the orientation of the eutectic liquid must be taken into account during selecting an interlayer.
而在接触反应钎焊的中间层材料选择过程中，考虑接触反应液相产生的方向性是发挥接触反应钎焊优越性的保障。
So, in order to gain good brazed joint in contact reactive brazing, the orientation of the eutectic liquid must be taken into account during selecting an interlayer.
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