用混合酸、清洗剂和纯水在清洗槽或超声波清洗机内清洗硅片，使其表面洁净并烘干。
Wash the wafers with mixed acid, lotion and UPW (ultra pure water) by ultrasonic cleaning in wet sinks to get a clean and dry surface of wafers.
安装布置灵活，根据需要超声辐射面可布置在清洗槽的底面，侧面或顶面。
Based on the demand, the ultrasonic radiation surface can be laid underside the launder slot or on the side face or on the peak face, it is quite agility.
使用超声波，整个槽都有空化产生，水下的零件各个面都会被清洗。
With ultrasonics, cavitation occurs throughout the tank, and all sides of submerged parts are cleaned.
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