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用混合酸、清洗剂和纯水在清洗槽或超声波清洗机内清洗硅片，使其表面洁净并烘干。
Wash the wafers with mixed acid, lotion and UPW (ultra pure water) by ultrasonic cleaning in wet sinks to get a clean and dry surface of wafers.
使用超声波，整个槽都有空化产生，水下的零件各个面都会被清洗。
With ultrasonics, cavitation occurs throughout the tank, and all sides of submerged parts are cleaned.
在现存设备中，如果已有普通清洗槽，则可加进震板装置，改装成超声波清洗机。
In extant equipment, if got ordinary clear tank washer, then may tote shaken-board installment, re-equips the ultrasonic cleaner.
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