薄膜集成电路采用薄膜工艺在蓝宝石、石英玻璃、陶瓷、覆铜板基片上制作电路元、器件及其接线，并加以封装而成。薄膜工艺包括蒸发、溅射、化学气相淀积等。特点为电阻、电容数值控制较精确，且数值范围宽，但集成度不高，主要用于线性电路。
复合薄膜集成电路 thick film integrated ; TFI
厚薄膜集成电路 Thick & ; Thick& ThinFilmIntegratedCircuit ; Thick & Thin Film Integrated Circuit
薄膜集成电路工艺 [电子] thin-film IC process
薄膜混合集成电路 thin film hybrid integrated circuit ; Thin-film hybrid IC
薄膜集成电路处理 thin film IC process
全薄膜化集成电路 all-thin-film IC
薄膜微波集成电路 thin film MIC
薄膜和混合集成电路 Film and hybrid integrated circuits
集成电路有厚膜集成电路和薄膜集成电路。
The integrated circuit contain thick film integrated circuit and the thin film integrated circuits.
因此，可以容易地制造包含薄膜集成电路的半导体器件。
Therefore, a semiconductor device including a thin film integrated circuit can be manufactured easily.
半导体器件。集成电路。第20部分：薄膜集成电路及混合薄膜集成电路的总规范。
Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits.
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