等离子体加工技术是在半导体制造中创立起来的一种新技术。

Plasma processing technology is a new technology developed in semiconductor manufacturing.

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首先，根据大气等离子体加工的原理及要求介绍了该数控加工系统的组成。

First, according to the principle and requirements of the APPP, the numerical control system composition was presented.

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研究了该系统的平台设计、大气等离子体加工工艺特性及其数控加工过程。

The design of a system platform, APPP process characteristics and numerical control process were investigated.

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