电镀液是指可以扩大金属的阴极电流密度范围、改善镀层的外观、增加溶液抗氧化的稳定性等特点的液体。
... 胶片冲洗 Photographic Chemicals 电镀液 Plating Solutions 磁性涂料 Magnetic Coatings ...
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离子色谱法测定电镀液中Fˉ和Clˉ 关键词：F～；CI一；离子色谱；蒸馏法；电镀液 [gap=4882]Key words：fluoride；chloride；ion chromatography；distillation；electroplate liquid
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... 外部电路，包含有交流电源、整流器、导线、可变电阻、电流计、电压计。阴极、或镀件(work)、挂具(rack)。 电镀液(bath solution)。 阳极(anode)。 ...
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... Baths (Oxygen–)B浴用氧气 Galvanizing baths电镀液 galvanizing baths电镀电解浸液 ...
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铑电镀液 Rhodium electroplating solution ; The rhodium eletroplating solution
铬电镀液 Chrome Plating Solution
汞电镀液 Mercury Plating Solution
需要的材料为铜电镀液 Copper Electroplating
电镀液消泡剂 LYXP
硫酸镍电镀液 nickel sulphate electroplating solution
镀锡电镀液 tin plating electrolyte
镍钴电镀液 Ni-Co electroplating solution
电镀液的定量补给 Quantitative supply of electroplate liquid
适用于PC b板含浸过程中遮蔽金手指部分和防止电镀液浸入及污染。
Used in the masking operation during wave solder process on PCB, prevented electroplating liquid immersing and polluting.
此法已被成功应用于测定锡-铜-铅合金电镀液及其镀层中的锡、铜和铅。
Cu and Pb ions in the alloy plating bath and composition of its deposits.
电流密度的变化的上限和下限是由电镀液的本性﹐浓度﹐温度和搅拌等因素决定的。
The change of the current density of the upper and lower specification limits by plating solution is the nature of concentration, temperature and stirring, factors such as the decision.
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