Adaptive algorithm is used to realize IMC growth during simulation, and energy fatigue model is used to predict solder ball lifetime.
采用改进算法,在计算过程中引入了IMC厚度的变化,利用能量法预测了焊球寿命。
参考来源 - BGA封装器件焊球剪切实验及模拟研究·2,447,543篇论文数据，部分数据来源于NoteExpress
焊球尺寸的减小导致了焊球强度也随之降低。
应力是导致焊球失效的直接原因，进而致使器件失效。
The stress is the direct cause to lead to solder balls failure, which causes microelectronic devices damage.
本文介绍了用于高速光电组件的表面安装型焊球阵列（BGA）封装技术。
Surface mount BGA Packaging Technology for high-speed Optoelectronic modules is described in this paper.
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