倒装焊中复合SnPb焊点形态模拟 -文本浏览模式- 文档 - 枢研网 关键词 : 倒装焊 ; 焊点形态 ; 模拟 [gap=1422]Key words : flip2chip technology ;solder joint geometry ;simulation
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...龙源期刊网 关键词：倒装焊；模板；焊点形态；可靠性；热疲劳寿命 [gap=954]Keywords: Flip-chip；stencil；solder joint shape；reliability；thermal fatigue life ...
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基于最小能量原理和焊点形态理论，建立了LCCC器件焊点三维形态预测模型。
The 3-d evolving model of LCCC solder joint shape is based on the minimal energy principle and the solder joint shape theory.
基于最小能量原理建立了多芯片组件(MCM)倒装焊焊点成形预测模型，对其三维焊点形态进行了有效预测。
Based on minimal energy principle, Evolving model of flip-chip 3-d shape prediction of MCM is established, and 3-d solder shape is effectively predicted.
这一结果对于焊点几何形态的设计及优化具有指导意义。
The results are of importance to design and optimize of geometry shape of the solder joint.
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