基于最小能量原理和焊点形态理论，建立了LCCC器件焊点三维形态预测模型。
The 3-d evolving model of LCCC solder joint shape is based on the minimal energy principle and the solder joint shape theory.
基于最小能量原理建立了多芯片组件(MCM)倒装焊焊点成形预测模型，对其三维焊点形态进行了有效预测。
Based on minimal energy principle, Evolving model of flip-chip 3-d shape prediction of MCM is established, and 3-d solder shape is effectively predicted.
这一结果对于焊点几何形态的设计及优化具有指导意义。
The results are of importance to design and optimize of geometry shape of the solder joint.
提出了一种用触针测量法研究焊点三维形态的实验方法，并对计算结果和实验结果进行了比较，结果表明，计算结果与实验结果吻合良好。
Moreover, an experimental method of touch pin measurement to analysis solder joint shapes was put forward, the results show the calculating results and the experimental results were identical well.
给出了不同的钎料量对应的焊点剖面形态的变化。
And the different section shape of the solder joint is given with the variation of solder volume.
给出了不同的钎料量对应的焊点剖面形态的变化。
And the different section shape of the solder joint is given with the variation of solder volume.
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