有活性的金属表面容易被熔融焊料浸湿。
Activated metal surface is easily wetted by the molten solder.
该装置(1)可使溶出于包含以锡作为主成分的无铅焊料中的铜作为金属间化合物析出以分离铜。
The apparatus (1) enables copper which has dissolved in a lead-free solder comprising tin as the main ingredient to precipitate as an intermetallic compound to separate the copper.
结果表明，添加微量高熔点金属对焊料的熔融特性影响小于2%。
The results indicated that small amount of high melting point metals had less than 2% effect on melting properties of previous lead-free solders.
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