• 有活性金属表面容易熔融焊料浸湿

    Activated metal surface is easily wetted by the molten solder.

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  • 装置(1)可使出于包含以锡作为主成分的无铅焊料中的作为金属化合物析出分离铜。

    The apparatus (1) enables copper which has dissolved in a lead-free solder comprising tin as the main ingredient to precipitate as an intermetallic compound to separate the copper.

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  • 结果表明,添加微量熔点金属焊料熔融特性影响小于2%。

    The results indicated that small amount of high melting point metals had less than 2% effect on melting properties of previous lead-free solders.

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  • 焊料凸块含钴底部金属层结合可延长无铅焊接倒装的寿命。

    The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is stated.

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  • 文章通过试验证明纯锡焊料底部凸块金属焊层结合可延长无铅焊接倒装寿命

    In the article experiment prove:combination with feine tin-solder-bumps and underbump-metalliza with cobalt be able to longthen life of leadless flip-chip-solderng.

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  • 根据发明,不含树脂的金属粉末特别是焊料一种凝胶体制成,其中,根据本发明的凝胶体重熔金属粉末的过 程,不在金属表面上留下残留物。

    The invention relates to a nonresinous solder paste made of a metal powder, especially soft solder, and a gel which leaves no residues on the metal surface when the metal powder is melted down.

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  • 某些情况下必要一种熔融温度焊料连接金属表面

    In some cases it may be necessary to connect metal surfaces by means of a hard spelter solder which fuses at hight temperature.

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  • 某些情况下必要一种熔融温度焊料连接金属表面

    In some cases it may be necessary to connect metal surfaces by means of a hard spelter solder which fuses at hight temperature.

    youdao

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