本文对晶体二极管引线光亮电镀锡的可焊性进行了研究。
This article conducts a research on the weldability of crystal diode lead wire luminous electrotinning.
引线框架电镀层的质量直接影响着钽电容器的可焊性，所以引线框架电镀层质量的测定方法至关重要。
The Quality of lead frame plating layer directly affects the solderability of tantalum capacitor, so its measuring methods are very important.
引线键合的效率主要依赖于受表面特性影响的键合点的可焊性。
The yield of wire bond mainly depends on the bondability of the bond pad which is affected by the surface characteristics.
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