本文对晶体二极管引线光亮电镀锡的可焊性进行了研究。
This article conducts a research on the weldability of crystal diode lead wire luminous electrotinning.
引线框架电镀层的质量直接影响着钽电容器的可焊性，所以引线框架电镀层质量的测定方法至关重要。
The Quality of lead frame plating layer directly affects the solderability of tantalum capacitor, so its measuring methods are very important.
引线键合的效率主要依赖于受表面特性影响的键合点的可焊性。
The yield of wire bond mainly depends on the bondability of the bond pad which is affected by the surface characteristics.
清洁处理 （Cleaning treatment）待焊的导线、 元器件引线、接线端子及印制电路板均应进行清洁处理，并保证其可焊性。
The wires, element leads, connection terminals to be welded and printed circuits should be treated clean and kept their weld ability.
清洁处理 （Cleaning treatment）待焊的导线、 元器件引线、接线端子及印制电路板均应进行清洁处理，并保证其可焊性。
The wires, element leads, connection terminals to be welded and printed circuits should be treated clean and kept their weld ability.
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