塑封集成电路因其是非气密性封装，封装材料热膨胀系数的不同以及被粘接材料表面能低，是造成塑封电路离层或开裂的内部原因。
First of all, the internal reason for the delamination or cracking is the different CTE of the packaging materials and the low surface energy of the adhesions.
试验结果表明：结构在正常使用荷载作用下完全处于弹性工作状态，具有足够的开裂安全系数和强度安全系数。
The test results indicate the structure completely work at elastic state under the normal applying load and have enough cracking and strength safety factor.
计算得到的敏感系数能够表示结构内部温度变化和收缩这两个因素对于混凝土结构早期开裂的影响程度。
Sensitivity coefficient obtained from calculation can represent how much the internal temperature variation and contraction affects the early crack of concrete structure.
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