塑封集成电路因其是非气密性封装，封装材料热膨胀系数的不同以及被粘接材料表面能低，是造成塑封电路离层或开裂的内部原因。
First of all, the internal reason for the delamination or cracking is the different CTE of the packaging materials and the low surface energy of the adhesions.
试验结果表明：结构在正常使用荷载作用下完全处于弹性工作状态，具有足够的开裂安全系数和强度安全系数。
The test results indicate the structure completely work at elastic state under the normal applying load and have enough cracking and strength safety factor.
计算得到的敏感系数能够表示结构内部温度变化和收缩这两个因素对于混凝土结构早期开裂的影响程度。
Sensitivity coefficient obtained from calculation can represent how much the internal temperature variation and contraction affects the early crack of concrete structure.
如果剪力滞系数过大，则应采取相应的措施防止这种应力集中现象出现，防止因产生局部开裂或失稳而造成结构的破坏。
If the shear lag is too large, should take appropriate measures to prevent such stress concentration phenomena, and to prevent cracking or buckling due to local production caused structural damage.
研究了湿应力开裂过程并提出了估算水分扩散系数和吸湿深度的方法。
The methods to estimate the moisture diffusivity and the absorption depth were developed for the fissure rice caused by the wet stress.
这种纸导热系数低，专门设计应用于对纯度要求高，抗开裂、高强度和抗热的应用场合。
These papers exhibit very low thermal conductivity and are designed for use in applications where purity, cracking resistance, high strength and resistance to heat are paramount.
这种纸导热系数低，专门设计应用于对纯度要求高，抗开裂、高强度和抗热的应用场合。
These papers exhibit very low thermal conductivity and are designed for use in applications where purity, cracking resistance, high strength and resistance to heat are paramount.
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