... (4) so as to cover or surround，thoroughly盖住或包围，彻底地——加在其含义与之稍有差别或不全相同的动词前变成新动词 enwrap包入，卷入 endermic皮下的 ...
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COF是一种高性能、多芯片封装工艺技术，在此封装中把芯片包入模塑塑料基板中，通过在元器件上形成的薄膜结构构成互连。
COF is a high performance, multichip packaging technology in which dies are encased in a molded plastic substrate and interconnects are made via a thin-film structure formed over the components.
以特制酱汁煎煮饼皮后，包入豆泥或马铃薯，再搭配起司丝和酸奶酱。
Set of two tortillas stuffed with refried beans or potatoes then cheese and cooked in enchilada sauce and topped with sour cream.
不过，一旦开始将代码分入不同的包、定义接口并将工作委托给其他人，项目管理会变得更复杂。
However, once you start separating your code into different packages, defining interfaces, and delegating work to others, your projects can become more complex to manage.
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