The effects of incident laser fluence, pulse repetition frequency, scanning speed upon the depth, width and dicing quality of microgrooves were investigated.
研究了紫外激光划切工艺中,入射激光能量密度、激光脉冲重复频率、扫描速度等参数对划切深度、宽度、表面质量影响。
参考来源 - 高亮度LED晶圆紫外激光划片技术研究·2,447,543篇论文数据，部分数据来源于NoteExpress
砂轮划片机划切技术的研究和应用直接关系到设备应用的好坏。
The research and application on dicing technology of wheel wafer dicer directly decides the relevant equipment application status.
本论文对紫外激光应用于蓝宝石晶圆和碳化硅等材料的划切加工技术进行了部分理论与试验研究工作。
In this paper, part of theoretical and experimental studies on the application of UV laser in dicing of sapphire wafer and SiC were presented.
杰德疲惫的脸、划烂的手、肮脏的衣服和瘦弱的身体就已说明了一切。
Jed's tired face, his torn hands, dirty clothes and thin body told the story.
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