本论文对紫外激光应用于蓝宝石晶圆和碳化硅等材料的划切加工技术进行了部分理论与试验研究工作。
In this paper, part of theoretical and experimental studies on the application of UV laser in dicing of sapphire wafer and SiC were presented.
砂轮划片机划切技术的研究和应用直接关系到设备应用的好坏。
The research and application on dicing technology of wheel wafer dicer directly decides the relevant equipment application status.
杰德疲惫的脸、划烂的手、肮脏的衣服和瘦弱的身体就已说明了一切。
Jed's tired face, his torn hands, dirty clothes and thin body told the story.
我曾在大脑中模拟过这个动作，在岸上也练过数百次，但突然间一切都在水里实现了，仅仅是靠推迟一点点划水。
I had mentally visualized this, and even demonstrated the movement on dry land hundreds of times…but it suddenly came together in the pool just by delaying the stroke a fraction of a second.
我曾在大脑中模拟过这个动作，在岸上也练过数百次，但突然间一切都在水里实现了，仅仅是靠推迟一点点划水。
I had mentally visualized this, and even demonstrated the movement on dry land hundreds of times…but it suddenly came together in the pool just by delaying the stroke a fraction of a second.
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