若配上紧压装置还可以用于扇形导体的绞制紧压、圆形导体绞合拉制紧压及分割导体预扭紧压等。

If equipped with a pressing device, it is used for stranding sector conductor, round conductor and compacted & pre-spiraled separated conductor.

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基于激光的分割方法，待分割物体，和半导体元件芯片。

Laser based splitting method, object to be split, and semiconductor element chip.

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实验结果表明该算法能够有效提高图象分割的质量，从而提高了半导体器件检测的正确率和自动化程度。

Finally an optimal method is developed. Experiment results show that the method can enhance the quality of image segment...

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