若配上紧压装置还可以用于扇形导体的绞制紧压、圆形导体绞合拉制紧压及分割导体预扭紧压等。
If equipped with a pressing device, it is used for stranding sector conductor, round conductor and compacted & pre-spiraled separated conductor.
基于激光的分割方法，待分割物体，和半导体元件芯片。
Laser based splitting method, object to be split, and semiconductor element chip.
实验结果表明该算法能够有效提高图象分割的质量，从而提高了半导体器件检测的正确率和自动化程度。
Finally an optimal method is developed. Experiment results show that the method can enhance the quality of image segment...
实验结果表明该算法能够有效提高图象分割的质量，从而提高了半导体器件检测的正确率和自动化程度。
Finally an optimal method is developed. Experiment results show that the method can enhance the quality of image segment...
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