这些关键应用所考虑的其它因素包括：元件封装设计、工作电源范围和钽器件优异的电容-电压（CV）特性。
Otherconsiderations for these critical applications include component package design, working voltage ranges and the advantageous CV levelsof tantalum devices.
讨论与此种LED封装性能密切相关的议题：基础的芯片技术、合适的的封装设计和初级光学元件。
Discussed are the crucial components for the performance of this LED package as the underlying chip technology, the suitable package design and the fitting primary optics.
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