这些关键应用所考虑的其它因素包括:元件封装设计、工作电源范围和钽器件优异的电容-电压(CV)特性。
Otherconsiderations for these critical applications include component package design, working voltage ranges and the advantageous CV levelsof tantalum devices.
讨论与此种LED封装性能密切相关的议题:基础的芯片技术、合适的的封装设计和初级光学元件。
Discussed are the crucial components for the performance of this LED package as the underlying chip technology, the suitable package design and the fitting primary optics.
讨论与此种LED封装性能密切相关的议题:基础的芯片技术、合适的的封装设计和初级光学元件。
Discussed are the crucial components for the performance of this LED package as the underlying chip technology, the suitable package design and the fitting primary optics.
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