... flip chip bonder 倒装焊接机 flip chip bonding 倒装焊接 flip coil 探测线圈 ...
基于168个网页-相关网页
... 全部倒装 full inversion ; Complete Inversion 倒装焊接 flip chip bonding ; face down bonding 点题倒装 Signpost inversion ...
基于138个网页-相关网页
·2,447,543篇论文数据，部分数据来源于NoteExpress
本论文研究了MCM中芯片安装互连、芯片倒装焊接及其关键支撑技术等内容。
This paper talks about the major supporting technologies for MCM package: the Interlinkage of Chips, Flip Chip Bonding, Flip Bonding.
IC芯片以倒装焊接或金属线焊接或粘贴连接安装于金属基片的有介质涂层的表面。
An IC chip is mounted by flip chip or wire bonding or adhesive connection on the face of the metal substrate which has the dielectric coating thereon.
利用氧化铟易于溶于酸性溶液的性质，提出了在倒装焊接之前使用酸性溶液对铟柱进行酸洗。
This article presents acid could be used to wash the indium bumps before flip chip bonding, based on indium oxide dissolved in acid.
应用推荐