本论文研究了MCM中芯片安装互连、芯片倒装焊接及其关键支撑技术等内容。
This paper talks about the major supporting technologies for MCM package: the Interlinkage of Chips, Flip Chip Bonding, Flip Bonding.
IC芯片以倒装焊接或金属线焊接或粘贴连接安装于金属基片的有介质涂层的表面。
An IC chip is mounted by flip chip or wire bonding or adhesive connection on the face of the metal substrate which has the dielectric coating thereon.
利用氧化铟易于溶于酸性溶液的性质，提出了在倒装焊接之前使用酸性溶液对铟柱进行酸洗。
This article presents acid could be used to wash the indium bumps before flip chip bonding, based on indium oxide dissolved in acid.
钢制储罐现场安装时，无论是正装法施工还是倒装法施工，焊接变形的控制是关键点。
When steel system kept a bottle the spot to install, regardless was packing a method construction to still set up wrong a method construction, the control which welds to transform is a key to order.
文章通过试验证明：纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
In the article experiment prove:combination with feine tin-solder-bumps and underbump-metalliza with cobalt be able to longthen life of leadless flip-chip-solderng.
纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is stated.
纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is stated.
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