hay wafering machine 干草压饼机
wafering hay 制干草块
wafering saw 多刃锯
Blind Wafering Study 盲切片研究
Crystal growth and Wafering 晶体生长和晶片制备
hay pickup wafering machine 干草压饼机
Precision Wafering Systems division 其精密切片系统部
以上来源于: WordNet
N-COUNT A wafer is a thin crisp biscuit that is usually eaten with ice cream. 威化饼干
The parameters deciding the quality in polishing process are as follows: slurry, temperature, wafering time, and so on.
抛光过程中决定抛光质量的参数有：抛光浆体、抛光温度、抛光时间等。
Thirdly, the parameters deciding the quality in polishing process are as follows: slurry, polish pad, pressure, temperature, rotation speed, wafering time, and so on.
在抛光工艺中，抛光液的种类、抛光垫的选择、抛光压力、温度、抛光盘转速、加工时间等诸多条件都是决定抛光质量的重要因素。
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