答：⑴锯晶圆(wafer saw)⑵晶圆磨薄(wafer lapping)⑶晶圆打光(wafer polis你好ng)⑷化学机械研磨晶圆湿洗净装备有那几种?
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...磨(edge rounding) Wafer movement Wafer Wafer Before Edge Rounding Wafer After Edge Rounding 45 • 晶片研磨(wafer lapping) – 传统粗级抛光 – 移除表面的缺陷与损伤 • 湿蚀刻(wet etch) – 4:1:3 mixture of HNO 3 (79 wt% in H 2 O), HF (49 wt% in ...
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