【wafer-level_packaging】什么意思_英语wafer-level_packaging的翻译_音标_读音_用法_例句_在线翻译

wafer-level packaging

晶圆级封装

... wafer-level burn-in 晶圆级老化 wafer-level packaging 晶圆级封装 wafer-level test 晶圆级检测 ...

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短语

Wafer Level Packaging 晶圆级封装技术 ; 晶片级封装

Wafer Level Chip Scale Packaging 晶圆片级芯片规模封装 ; 芯片尺寸封装

Wafer Level Stack Packaging 使用晶圆级堆叠封装

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·2,447,543篇论文数据，部分数据来源于NoteExpress

abstract: Wafer-level packaging (WLP) is the technology of packaging an integrated circuit at wafer level. WLP is essentially a true chip scale package (CSP) technology, since the resulting package is practically of the same size as the die.

以上来源于: WordNet

Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.

阐述了MEMS的主要封装工艺和技术，包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。

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