...体电路的构装基材;如欲制成具多层传导电路结构的陶瓷基板,生胚片须施予冲片(Blanking), 打孔 ( Punching ),导孔填充(Via Filling),
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This paper introduced a copper plating process for micro-via filling and through hole plating simultaneously in DC application.
介绍了一种利用直流电源进行微盲孔和通孔同时电镀的工艺，同时给出了相关的工艺条件和电镀效果。
Methods: Stress and emotional state of parents of 34 children with tumor were evaluated via filling out status-anxiety scale and questionnaire.
应用状态-特质焦虑量表，通过问卷调查的方法对34例肿瘤患儿父母的压力感受及情绪状态进行评估。
Method: a total of 46 college nursing students were selected and clinical practice behaviors description relativity study of them were carried out via filling out questionnaire.
方法：采用问卷调查法，对46名护理本科生临床实习行为进行相关性研究。
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