This paper introduced a copper plating process for micro-via filling and through hole plating simultaneously in DC application.
介绍了一种利用直流电源进行微盲孔和通孔同时电镀的工艺，同时给出了相关的工艺条件和电镀效果。
Methods: Stress and emotional state of parents of 34 children with tumor were evaluated via filling out status-anxiety scale and questionnaire.
应用状态-特质焦虑量表，通过问卷调查的方法对34例肿瘤患儿父母的压力感受及情绪状态进行评估。
Method: a total of 46 college nursing students were selected and clinical practice behaviors description relativity study of them were carried out via filling out questionnaire.
方法：采用问卷调查法，对46名护理本科生临床实习行为进行相关性研究。
Method: a total of 436 parents were divided into 3 groups according to their education levels and investigated via filling out self-designed planed immunization knowledge questionnaire.
设计计划免疫知识问卷，对43 6位家长进行调查，按不同文化程度分为3组，对问卷进行统计分析。
Based on experimental data, empirical correlation on filling ratio was obtained via regression.
根据试验数据拟合出合理充液率的经验关系式。
This article mainly introduces an alternative to the squeegee for Via-filling processes which is called enclose-head screen-printing or Mass Imaging.
主要介绍导通孔填充制程的另一种替代方法，即用封闭头网板印刷的细节，也称封闭式整体印刷方法。
The purpose of this paper is from chemical, physical & substrate aspects to explore several influence factors of via-filling plating process.
分别从化学、物理及基板三方面探讨了影响电镀填孔工艺的一些基本因素。
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Should you have any queries, please do not hesitate to contact us via telephone, fax or email. You may also provide information by filling up the following form. We will get back to you soon.
如有任何查询，可以电话、传真或电邮方式联络我们，亦可利用以下“查询或洽商”表格将详尽资料传递给我们，我们会尽快与您联络。
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