Vertical Via Interconnect 垂直通孔互连
As a vertical interconnect channel, through-hole plays an important role in multi-layer PCBs and IC packages.
通孔作为垂直互联的主要实现方式在多层印制电路板和芯片封装中起着至关重要的作用。
FDTD method is better than the other one for vertical via interconnect problem.
对于垂直通孔互连问题，时域有限差分法更具优势。
Because vertical via interconnect is the base of theoretical analysis and package technics of MMCM, further study on vertical via interconnect is very vital and instructive to reality.
垂直通孔互连是微波多芯片组件封装工艺和理论分析的基础，开展垂直通孔互连的研究有着现实的意义。
应用推荐