As a vertical interconnect channel, through-hole plays an important role in multi-layer PCBs and IC packages.

通孔作为垂直互联的主要实现方式在多层印制电路板和芯片封装中起着至关重要的作用。

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As a vertical interconnect channel, through-hole plays an important role in multi-layer PCBs and IC packages.

通孔作为垂直互联的主要实现方式在多层印制电路板和芯片封装中起着至关重要的作用。

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