The effects of the curing process of the underfill on the vertical crack stress on top of the die, maximum equivalent stress of the low-k layer and equivalent plastic stain of the solder joint were investigated by finite element software.
通过有限元软件研究了底充胶固化工艺对芯片上方垂直开裂应力、焊点等效塑性应变及低k层最大等效应力的影响。
参考来源 - 底充胶固化工艺对低k倒装焊器件可靠性的影响The early studies usually described the underfill materials as classical linear elasticity in order to get a better computational efficiency. But the underfill shows significant viscoelasticity actually.
不同的材料模型对有限元模拟的结果会产生直接的影响,以往的研究通常会将下填料的材料模型简化为经典线弹性模型,以提高计算效率,但这与下填料表现的粘弹性特征有明显的区别。
参考来源 - 微电子倒装芯片封装粘弹性断裂研究·2,447,543篇论文数据，部分数据来源于NoteExpress
Fill in the chart under "What".
填表格写在“ What ”下面。
Fill determines the color of the fill area under the line in area line graphs and determines the bar fill color for bar and column graphs.
fill指定区域线形图中的线条下方的填充区域的颜色，以及条形图和柱形图的条填充颜色。
M: What should I fill in under the room number?
M：“房间号码”这一栏我该怎么填呢？
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