其应用在汽车零件、家电产品、五金零件、印刷电路板(circuit boards)，穿孔电镀(through-hole plating)，EMI/RFI Shielding等电子元件制作。
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Through-hole plating in multilayer PCB is a key process of plating.
多层PCB的孔金属化是PCB制板的一个关键环节。
参考来源 - 孔金属化设备控制系统的硬件改进和软件设计·2,447,543篇论文数据，部分数据来源于NoteExpress
This paper introduced a copper plating process for micro-via filling and through hole plating simultaneously in DC application.
介绍了一种利用直流电源进行微盲孔和通孔同时电镀的工艺，同时给出了相关的工艺条件和电镀效果。
A process for through hole plating is reviewed in which conventional electroless copper plating is replaced by deposition of a carbon black-graphite layer.
综述了一种对印制线路板通孔镀的方法，即在孔壁上沉积有电镀用的碳黑—石墨层，以取代传统的化学镀铜工艺。
The plating liquid having reached the upper end circulates through the through-hole of the tubular electrode.
已经到达上端的电镀液穿过管状电极的通孔循环。
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