其应用在汽车零件、家电产品、五金零件、印刷电路板(circuit boards)，穿孔电镀(through-hole plating)，EMI/RFI Shielding等电子元件制作。
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plating through hole 镀通孔 ; 通孔
Non-plating Through Hole Board 非孔化印制板
Through-hole plating in multilayer PCB is a key process of plating.
多层PCB的孔金属化是PCB制板的一个关键环节。
参考来源 - 孔金属化设备控制系统的硬件改进和软件设计·2,447,543篇论文数据，部分数据来源于NoteExpress
This paper introduced a copper plating process for micro-via filling and through hole plating simultaneously in DC application.
介绍了一种利用直流电源进行微盲孔和通孔同时电镀的工艺，同时给出了相关的工艺条件和电镀效果。
A process for through hole plating is reviewed in which conventional electroless copper plating is replaced by deposition of a carbon black-graphite layer.
综述了一种对印制线路板通孔镀的方法，即在孔壁上沉积有电镀用的碳黑—石墨层，以取代传统的化学镀铜工艺。
The technology of the plating through hole of the printed circuit board was briefly introduced the plating through hole technology of the microwave printed circuit board were also illuminated.
本文在简单介绍印制板孔金属化加工技术的基础上，对微波印制板孔金属化加工技术进行了较为详细的论述。
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