sputtering process control 溅射工艺控制
magnetic sputtering process 磁控溅射工艺
magnetron sputtering process 磁控溅射工艺
The source material for a sputtering process.
溅射工艺用源材料。
Its approach is to deposit the CIGS layer using a sputtering process borrowed from the disk-storage industry.
它的方法是通过借鉴于碟片储存行业的“喷溅”处理来沉积CIGS层面。
The results show that the sputtering process factors have large effect on the compositions and magnetic properties.
结果表明,溅射工艺因素对薄膜的成份和磁性能有较大的影响。
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