The chemical is widely used in the production of LSI, VLSI and other semiconductors to remove photoresist edge bead that occurs during typical spin coat wafer processing.
该试剂用于清除匀胶后残留于硅片边缘及背面的光刻胶，已经广泛应用于中、大规模集成电路及其它半导体器件的生产。
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